TF-MLC

Applicable to use in HPC, IoT, AI devices. TFs are able to turn pitches from large to small for TFs and applicable to pitches smaller than 100µm.

The CTE (coefficient of thermal expansion) and Dk/Df (electrical performance) of MLC are better than MLO, which is still widely used in the industry. Therefore, MLC is expected to replace MLO in the future and be used in automotive applications with tri-temp and small pitch requirements.