Products & Service

FIMS

Fully automated probe mark depth measurement equipment; integrated with Prober; and support the full automation of semiconductor factories.

Specification

Optics

WLI White Light Interference

Z resolution

20 nm

FOV

245 x 260 µm

Speed

<3s / FOV

Algorithm

Deep Learning Adaptive Measurement

Allows for high-speed 3D imagining, supports pad and bump targets, and is able to perform a FOV measurement in about 3 seconds.
Integrates deep learning to measure depth, height, and position and can generate wafer-scale measurement results.

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